User-replaceable RAM could return to the Mac in 2026
Apple is rumored to switch to a separate, so-called discreet package for the iPhone’s RAM, a change that could bring user-replaceable RAM back to the Mac.
Korean publication The Elec has learned that Apple has tasked Samsung with developing a discreet memory package for future iPhones in order to make the RAM run faster. The only motivation for the rumors change is the need to speed up Apple Intelligence, which requires Apple silicon with at least eight gigabytes of RAM.
Apple has already doubled the base RAM on Macs from eight to sixteen gigabytes to better handle Apple Intelligence. Putting the RAM and the main processor on separate chips will speed up memory access for Apple Intelligence tasks.
If this change trickles down to the Mac, it could pave the way for user-upgradable RAM. All Macs powered by Apple silicon chips (M1, M2, M3, etc.) have the RAM stacked directly on Apple silicon. In semiconductor circles, this is known as package-on-package (PoP). According to The Elec, Apple wants a discrete (separate) memory packaging solution ready in time for the 2026 iPhone 18 models.
Apple silicon could switch to a separate RAM package
Samsung is apparently researching solutions at Apple’s request. It’s created a separate DRAM package larger than the main Apple silicon chip and is working on solutions to connect it back to the main chip via a wider, faster bandwidth. The change should make AI tasks run faster—because AI operations typically process large amounts of data, RAM speed is crucial.
The publication claims that Apple opted out of using high-bandwidth RAM modules which are used in servers because of size and power consumption concerns. One of Samsung’s solutions for Apple is reportedly a processor-in-memory design that integrates processing capabilities directly into the RAM.
To that end, Samsung is reportedly developing next-generation low-power double data rate memory technology for Apple, called LPDDR6. Those chips should bring 2-3 times faster data transfer speed and bandwidth than the LPDDR5X memory integrated into Apple’s A18 chips powering the iPhone 16 series.
The rips and cons of PoP silicon packaging
PoP has its advantages. For example, it reduces memory latency and boosts power efficiency by shortening the distance between the RAM and the main processor. However, PoP also limits the number of pins the RAM has versus a separate package that can be made larger and use more pins to improve memory bandwidth.
The publication explains why PoP isn’t optimal for on-device AI:
Bandwidth is determined by data transfer speed, data bus width, and data transmission channels. Bus width and channel are determined by the number of I/O pins. To increase the number of pins, the package needs to become larger. But in PoP, the memory’s size is determined by the SoC, which limits the number of I/O pins on the package.
Discreet RAM is not only faster but has other perks:
Discrete package also provides better heat regulation. On-device AI’s parallel processing causes high levels of heat. Having a larger surface for the memory allows heat to emitted in a wider surface.
As discreet RAM is larger than PoP, Apple might need to shrink other components such as the battery to fit it in Phone. Also, discreet memory consumes more power and increases latency because of the longer distance between it and the main chip.
User-replaceable RAM could be coming back to the Mac
If Apple and Samsung are indeed developing faster RAM to help speed up Apple Intelligence, it’s safe to assume that this change will trickle down to iPads and Macs. When the first M1-powered Apple silicon Mac made its 2020 debut, user-replaceable RAM on Macs flew out of the window.
With the PoP method, everything is packaged on a single system-on-a-chip (SoC), and there are no separate RAM modules that could be replaced; that’s why you must carefully choose the amount of RAM for your Mac on Apple’s online store—extra RAM cannot be added after the fact, not by you nor by Apple.
If 2026 Macs end up using discreet RAM, that doesn’t necessarily mean it’ll be easy to replace as Apple could solder the RAM to the logic board like it did in the past instead of using user-replaceable RAM modules. The dream lives on!
Source link: https://www.idownloadblog.com/2024/12/05/apple-iphone-mac-ram-separate-package-rumor/
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